Prof. Chi Ming CHAN's Publications
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Article
Lau, Yiu-Ting R., Schultz, Jerold M., Weng, Lu-Tao., Ng, Kai-Mo., Chan, Chi-Ming., "Control of the Fold Surface Conformation of the Lamellae of an Oligomer", Langmuir. v. 25, (14), 2009, JUL 21, p. 8263-8267 (2009) 
Gong, Guan., Wu, Jingshen., Lin, Yong., Chan, Chiming., Yang, Mingbo., "Dynamic Rheological Behavior of Isotactic Polypropylene Filled With Nano-Calcium Carbonate Modified by Stearic Acid Coating", Journal OF Macromolecular science PART b-physics. v. 48, (2), 2009, Mar, p. 329-343 (2009)
Zhang, Yang., Xiao, Xing., Zhou, Jian-jun., Wang, Lei., Li, Zhi-bo., Li, Lin., Shi, Lin-qi., Chan, Chi-Ming., "Re-assembly behaviors of polystyrene-b-poly(acrylic acid) micelles", Polymer. v. 50, (25), 2009, NOV 27, p. 6166-6171 (2009)
Conference paper
Lin, Yong., Chen, Haibin., Chan, Chi Ming., Wu, Jingshen., "Effect of surface modification of the filler on the impact toughness of Polypropylene/CaC03 nanocomposites", Bayreuth Polymer Symposium, Bayreuth, Germany. Sept. 12-15, 2009 (2009)
Lin, Yong., Chen, Haiben., Chan, Chi Ming., Wu, Jingshen., "Effects of surface modification of the filler on the impact toughness of Polypropylene/CaCO3 nanocomposites", American Chemical Society National Meeting. Salt Lake City, USA, March 22-26 (2009)
Ye, Y., Chen, H., Wu, J., Chan, C-M., Ye, L., "Properties of Advanced Fiber Composites with Halloysite Nanotube Toughened Epoxy Matrix", 17th International Conference on Composite Materials (ICCM-17), Edinburgh, Scotland (UK), 27-31 Jul 2009
. (2009)
Lau, Richard., Weng, Lu-Tao., Chan, Chi Ming., "Study of polymer chain folding by time-of-flight secondary ion mass spectrometry", International Conference on Secondary Ion Mass Spectrometry, Toronto, Canada. Sept. 14-18, 2009 (2009)
Chan, Chi Ming., Lin, Yong., Chen, Haibin., Wu, Jingshen., "Toughening Mechanism of Polypropylene/Calcium Carbonate Nanocomposites", Bayreuth Polymer Symposium, Bayreuth, Germany. Sept. 12-15, 2009 (2009)
Patent
Chan, Chi-Ming; Ng, Kai-Mo; Wong, Catherine Yuen-Chien; Cheung, Ying Kit, "Overvoltage protection materials and process for preparing same", US Patent. 7,589,611 B2, 2009 (2009)
